October 22, 2019
Participating Societies
“Bletchley Park: Enigma, Ultra, and the Making of Colossus”
The Development of the First Digital Computing Systems
“WPI & QCC make Giant LEAP for Integrated Photonics in New England” |
Panelists: Dr. James Eakin & Prof. Doug Petkie, Worcester Polytechnic Institute
& Prof. Jacob Longacre, Quinsigamond Community College
WPI and QCC are launching a LEAP facility in Massachusetts, with a focus on
design, characterization, reliability testing, and workforce development.
Information and Registration
“Call for Interactive Posters”
Students are invited to present novel concepts, development or work-in-progress to industry professionals representing a wide range of companies and technologies. We’re soliciting Interactive Poster Presentations on technologies and disciplines related to microelectronic and/or semiconductor topics such as materials, design, processes, mechanical-chemical analysis, metrology, reliability, packaging/systems and applications. Spend 2 hours in face-to-face discussions-Q&A with interested attendees from the New England Technology Community. |
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• Medical Devices & Packaging • RF & Microwave Technologies • Wire & Die Bonding, Flip Chip, Bumping, TSV • SMT & Electronics Assembly-Packaging • Thermal Materials, Designs Analysis • High temperature applications |
• Printed Electronics - Additive Manufacturing • 3D, WLCSP (fan in /out) packaging • MEMS Sensors & Nano-Opto Technology • Advanced Device Packaging • System in Package • New & Emerging Materials-Technologies |
Dipak Sengupta - sngdsg@gmail.com before Sept. 27, 2019
updates at www.imapsne.org
Information and Registration