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iMAPS New England Chapter |
Tuesday May 7th, 2019
Boxboro Regency Hotel, Boxborough, MA
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Session A:
Advanced Packaging Session Chairs:
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Thermodynamic Stability MAPS: A Powerful Engineering Design Tool
Abstract Robert Lacombe, Materials Science and Technology Conferences, LLC, Hopewell Junction, NY
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Void-Free Copper Pillar Hybrid Bonding using a Polymer Adhesive and Chemical Mechanical Polishing Abstract Presentation Hua Dong, DowDuPont Specialty Products (DuPont) Division, Marlborough, MA 01752
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Adhesion Considerations in Designing Dielectric Materials for Advanced Packaging Applications Abstract Presentation Michaela Connell, Stephanie Dilocker, Ognian Dimov, Sanjay Malik - Fujifilm Electronic Materials, Inc, North Kingstown, RI
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Volume Production Testing of Silicon Photonics Modules Case Study: Wafer Sort Test Coverage versus Through-Put Abstract John Ritchie, Straits Hi-Rel Pte. Ltd. Singapore
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An Electrical Fan-Out Wafer Level Packaging Test Vehicle and Update on the Advanced System Abstract John Allgair PhD, Amit Kumar, and Ankineedu Velaga – BRIDG, NeoCity, FL 34741
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Session B: Printed Electronics Session Chairs: |
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Curing Printed Conductive Layers on Low-Temperature Substrates with Intense Pulsed Light Abstract Guinevere Strack, Andrew Luce, Craig Armiento, and Alkim Akyurtlu - Electrical and Computer Engineering Department, Printed Electronics Research Collaborative, UMass Lowell, Lowell, MA
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Testing Methodology and Analysis of Fusing Current of Printed Conductive Inks on Dielectric Substrates Abstract Elicia Harper, Emily K. Engel, Susan C. Trulli, and Kara P. Upton - Raytheon Integrated Defense Systems, Andover, MA 01810
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Barium Strontium Titanate Nanocomposite Dielectric Inks for Flexible RF and Microwave Electronics Applications Abstract Oshadha Ranasignha, Mahdi Haghzadeh, Craig Armiento, and Alkim Akyurtlu - Electrical and Computer Engineering Department, Printed Electronics Research Collaborative, Raytheon – UMass Lowell, Lowell, MA
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Printed Phase Shifters for Antenna Arrays Abstract Shoket Ganjeheizadeh Rohani, Mahdi Haghzadeh, Craig Armiento, and Alkim Akyurtlu, Electrical and Computer Engineering Department, Printed Electronics Research Collaborative, Raytheon – UMass Lowell, Lowell, M
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Novel Techniques for Additive Manufacturing of Functional Materials Abstract Presentation L. Parameswaran 1, R. Mathews, L.M. Racz, Duncan, M. Plaut, T. Fedynyshyn - MIT Lincoln Laboratory, Lexington, MA 02421; Y. Kornbluth, L.F. Velásquez-García, Massachusetts Institute of Technology, Cambridge, MA; B. S. Uzel, R. Weeks, and J.A. Lewis - Harvard, Cambridge, MA
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Session C: RF & Microwave - 5G Innovations and Microwave Emerging Technologies I Session Chairs: |
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100nm GaN on Si Technology for 5G Applications Abstract Presentation Charles Edoua, OMMIC, Limeil-Brévannes Cedex France
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A Reconfigurable S/X-Band 25W GaN Power Amplifier MMIC Abstract Presentation Charles F. Campbell, Kevin W. Kobayashi and Cathy C. Lee, Qorvo Infrastructure and Defense Products, Richardson, TX
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GaN-on-Silicon for 5G Radios Abstract Presentation Timothy Boles ,Distinguished Fellow of Technology, MACOM Technology Solutions
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Advancement in TPG Graphite Based Technology for Chip?level Thermal Management Abstract Presentation Wei Fan, Liu Xiang, Brian Kozak, Kristi Scherler and Greg Shaffer Momentive Performance Materials, Inc., Strongsville, OH; Garry Wexler Henkel Corporation, Prescott, WI
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Think Outside The Cylinder Abstract Presentation Richard Howell, Cornell Dubilier/ TTI, Inc. Boston, MA
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Session D: Interconnects Session Chairs: |
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The Use of Designed Experiments in Process Development Abstract Presentation Lee Levine, Process Solutions Consulting, Inc., New Tripoli, PA 18066
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Zero Outgassing and Flux Residue Compatible Underfill Abstract Presentation John Yin, Mary Liu and Wusheng Yin, Ph.D , Yincae Advanced Materials, , LLC, Albany, NY 12205
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Introduction of Die Attach Hybrid Silver Adhesive Technology Abstract Presentation Yumi Shimada , Tanaka, Kikinzoku Kogyo, Japan
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Critical Review of MIL-STD-883 Wirebond Visual Inspection Criteria Abstract Presentation Tom Green TJ Green LLC, Bethlehem PA 18017
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Alternative Cu Wires for High Reliability Applications Abstract Presentation William (Bud) Crockett Tanaka, Japan
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Session E: Poster Presentations Session Chairs: |
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Challenges in Soldering an Air Cavity Package Using Tin Bismuth
Abstract Presentation Michael Johnson MACOM Technology Solutions
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Advanced Thermal Solutions for Laminate Substrate Designs Abstract Presentation Abi Reyes, Abimael Reyes, Jess Aldrich, Eric Eilenburg, Helen Leung, Paul Hogan, MACOM Technology Solutions
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Evaluation of the thermal properties of a Light Emitting Diode(LED) Package manufactured using Po-Kw Packaging technology Abstract Presentation Anisha Walwaikar, Krishnaswami Srihari, Daryl Santos (BINGHAMTON U),Christopher Kapusta, Liang Yin, Kaustubh Nagarkar (GE)
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Transient Liquid Phase Bonding Technology of Bi-Ni System for High-Temperature Electronics Abstract Presentation Hamid Fallahdoost and Junghyun Cho, State University of New York at Binghamton
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Evaluation of Mechanical Properties and Adhesion of Various Conformal Coatings Used in Electronic Packaging Abstract Presentation Preeth Sivakumar and Junghyun Cho, State University of New York at Binghamton
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The effect of solder paste volume on surface mount assembly self-alignment Abstract Presentation K. Pan, J. H. Ha, H.Y. Wang, S.B. Park, I. Parviziomran, State University of New York at Binghamton, D.H. Won, Koh Young Technology Inc., S.Korea
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A Study Of Substrate Models And Its Effect On Package Warpage Prediction Abstract Presentation Van-Lai Pham, Huayan Wang, Jiefeng Xu, Charandeep Singh, Jing Wang, S.B. Park, State University of New York at Binghamton
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Time 0 Void Evolution And Effect On Electromigration Abstract Jiefeng Xu, Huayan Wang, VanLai Pham, Stephen R. Cain, S.B. Park, State University of New York at Binghamton, Scott McCann, Gamal Refai-Ahmed, Xilinx Inc.
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Characterization of Silicon Die Filleting Process through dispensing Abstract Presentation Ludovico Cestarollo, Mohammed Alhendi, Darshana Weerawarne and Mark Poliks, State University of New York at Binghamton
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Process and Reliability Investigation of SnBi Assembly for BGA Components Abstract Presentation Chongyang Cai, Jiefeng Xu, Huayan Wang, S.B. Park, State University of New York at Binghamton
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Product Level Design Optimization for 2.5D Package Shock Impact Reliability Abstract Presentation Huayan Wang, Jing Wang, Jiefeng Xu, Vanlai Pham, S.B. Park, State University of New York at Binghamton, Hohyung Lee, Gamal Refai-Ahmed, Xilinx Inc., San Jose, CA
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Testing and evaluating flexural strength of stacked die configurations Abstract Presentation Ankita Korad, Daryl Santos, Krishnaswami Srihari, State University of New York at Binghamton, Salvatore Napoli, Analog Devices
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A high spatial resolution measure of trap states and charge motion in non-traditional semiconductors Abstract Presentation Jason P. Moscatello, Christina L. McGahan, and Katherine E. Aidala, Mount Holyoke College
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Liquid Metal Innovations for High-Performance TIMs Abstract Presentation Timothy Jensen, Indium Corporation
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Design of a Thermal Interface Material Cycling Reliability Test Program for Semiconductor Test Abstract Presentation David Saums, DS&A LLC, Tim Jenson, Ron Hunadi, Indium Corp., Mohamad Abo Ras, Berliner Nanotest and Design GmBH
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FTIR Based Identification Method of Underfill Materials and Matching System Abstract Presentation Junbo Yang, and Seungbae Park, State University of New York at Binghamton
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The Effect of Solder Paste Volume on Chip Resistor Solder Joint Fatigue Life Abstract Presentation Huayan Wang, Ke Pan, Jonghwan Ha, Changyang Cai, Jiefeng Xu, and Seungbae Park, State University of New York at Binghamton
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Session F: Novel Packaging Applications Session Chairs:
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Medical Imaging Applications - the Underlining Technology Abstract Dan Negrea, Senior VP New Technologies, AEMtec GmbH
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Fully Organic Packaging for Applications with Liquid Exposure Abstract Susan Bagen, Micro Systems Technologies, Inc., Lake Oswego, NY, Eckardt Bihler, Marc Hauer - MST Dyconex AG, Bassersdorf, Switzerland
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Advancements in Microelectronic Packaging for Medical Implants Abstract Presentation Carolyn Bjune, Draper Laboratory, Cambridge, MA 02139
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Think Like an Innovator, Act Like an Entrepeneur Abstract Angelique Johnson, MEMStim LLC, Louisville, KY
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Fabrication and Packaging of a MEMS Based Energy Harvester Abstract Yuechen Yang, Ujwal Radhakrishna, Dennis Ward, Anantha P. Chandrakasan, Jeffrey H. Lang - MIT, Cambridge, MA
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Session G: Photonics & Optoelectronics Packaging Session Chairs:
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Full-field Digital Holographic Vibrometry for Characterization of Optoelectronic Packaging and MEMS Abstract Cosme Furlong, Payam Razavi, Morteza Khaleghi, and Ivo Dobrev, Center for Holographic Studies and Laser micro-mechaTronics (CHSLT), Mechanical Engineering Department, Worcester Polytechnic Institute, Worcester, MA
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Industrial Automation Sensors and Industrial Internet of Things (IIOT) Abstract Yongyao Cai, Rockwell Automation
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High-Speed, High-Precision and High-Flexibility, Automated Die-Bonder for High-Power Laser Diode (HPLD) Packaging Abstract Rajiv Pandey, Jason Liu, and Julius Ortega, MRSI Mycronic
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Session H: RF & Microwave - 5G Innovations and Microwave Emerging Technologies II Session Chairs:
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Design Guidelines for Epoxy Preforms Abstract Presentation Scott MacKenzie, President, Bonding Source, Manchester NH
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Thermoplastic Polyimide (TPI) Adhesive Technology For RF Circuits Abstract Presentation Jim Fraivillig CEO and Founder, Fraivillig Technologies, Boston, MA
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Elevated Temperature Impact on Performance of LTCC Dielectrics Abstract Presentation Anton Polotai, Jim Henry, David Thoss, Yi Yang, and Sanjay Chitale, Ferro Corporation, Independence, OH
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Reliable Sealing of Metal Packages Abstract Presentation Tom Salzer, Hermetric, Inc., Bedford, MA 01730
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Photos of 2018 - 2019 Meetings - Photographer: Joseph W. Soucy
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Tuesday May 7th, 2019
Boxboro Regency Hotel, Boxborough MA
Call for Papers 2020
2019 Symposium Exhibitors
Earlybird Exhibitor Registration 2020
iMAPS New England Chapter
2018 - 2019 NE IMAPS Executive Committee
iMAPS - INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY
