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iMAPS New England Chapter |
Tuesday May 1st, 2018
Boxboro Regency Hotel, Boxborough, MA
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Session A:
MEMS Session Chairs: Stephen Bart, TDK / InvenSense SSBC , and Rick Morrison , Draper
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Resonant MEMS Acoustic Switch Package with Integral Tuning Helmholtz Cavity
Abstract Presentation Jonathan Bernstein, Mirela Bancu, Douglas Gauthier, Mitchell Hansberry, John LeBlanc, Olive Rappoli, Michael Tomaino-Iannucci, Marc Weinberg Draper, Cambridge, MA
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Nanoscale Si3N4 Tuning Fork Cavity Optomechanical Transducers Abstract Presentation Rui Zhang, Yundong Ren, Vladimir Aksyuk, Kartik Srinivasan, Yuxiang (Shawn) Liu – Worcester Polytechnic Institute, Worcester, MA
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Electrical Yield and Reliability Issues of Ultra High Density Interposers and Update on Advanced Integration Program at BRIDG Abstract Presentation John Allgair, Amit Kumar, Ankineedu Velaga - BRIDG, NeoCity, FL
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Development of Nanomaterial-based Smart Patches and Low-cost MEMS Devices Abstract Presentation Cihan Yilmaz, PhD - Flex Boston Innovation Center, Boston, MA
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Co-fabrication of micro-coaxial interconnects and substrate junctions for multi-chip microelectronic systems Abstract Presentation Daniela Torres(1), Anthony Kopa(1), Robert White(2), Caprice Gray(1) – 1 - Draper, Cambridge, MA; 2 - Tufts University, Medford, MA
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Ion Beam Milling for MEMs Applications Abstract Presentation James Barrett - Ion Beam Milling, Inc., Manchester, NH
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Session B: Printed Electronics Session Chairs: Dr. Greg Fritz, Draper and Dr. Craig Armiento, UMass Lowell
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Applications of Metal Additive Manufacturing to Defense Electronics Systems Abstract Presentation William Villers , – TEN TECH LLC, Los Angeles, CA
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Printed Electronics Using Magnetohydrodynamic Droplet Jetting of Molten Aluminum and Copper Abstract Presentation Bruce E. Kahn, Denis R. Cormier, K. Zope, D. Jayabal, and M. MedaRochester Institute of Technology, Rochester, NY
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Printed Electronics for Aerospace and Buildings Abstract Presentation Slade R. Culp – United Technologies Research Center (UTRC), East Hartford, CT
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Microplasma Sputtering for 3D Printing of Metallic Microstructures Abstract Presentation Lalitha Parameswaran(1), Y. Kornbluth(2), R. Mathews(1), L.M. Racz(1), L.F. Velásquez-García(2) 1 - MIT Lincoln Laboratory, Lexington, MA; 2 - Massachusetts Institute of Technology, Cambridge, MA
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Printed Conductive Traces for High Power Applications by Reaction-Assisted Sintering Abstract Presentation Sara C. BarronJ. B. DeLisio(1), J. W. Boley(2), J. A. Lewis(2), S. Vummidi Lakshman(3), S. Q. Arlington(3), T. P. Weihs(3), P. H. Lewis(1), V. Nguyen(1), B. R. Smith(1), G. M. Fritz(1); 1 – Draper, Cambridge, MA; 2 - Harvard University, Cambridge, MA; 3 - Johns Hopkins University, Baltimore, MD
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Advanced Packaging for Wearables Abstract Presentation Venkatadri Vikram, – Analog Devices Inc., Wilmington, MA
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Session C: RF and Microwave: Innovations & Emerging Technologies Session Chairs: Tom Terlizzi , GM Systems LLC and Chandra Gupta , Communications & Power Industries, LLC
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High Temperature RF Multi-layer Ceramic Capacitors (MLCC) Abstract Presentation Brian Ward – Vishay Americas, Shelton, CT
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Automotive example of RF immunity testing shows why Full-wave solvers compliment challenging measurements Abstract Presentation Tom Terlizzi, GM Systems LLC, Kings Park, NY
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Phase Noise Origins and Measurements Abstract Presentation Aaron Potosky ,Joe Koebel, and Jason Breitibarth - Holzworth Instrumentation, Boulder, CO
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A Heterogeneous SIP Solution for RF Applications Abstract Presentation Justin Borski(1) , and Benjamin McMahon (2), 1 - i3 Microsystems Inc., St. Petersburg, FL; 2 - BAE Systems, Merrimack, NH
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Packaging’s Role in RF and Micro-Electronics Abstract Presentation Keith Donaldson (1) , Joe Spitz (2), 1 - Intercept Technology Inc.; 2 - Liberty Packaging Company, Braintree, MA
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Session D: Novel Packaging Applications Session Chairs: Caroline Bjune , Draper and Mohammed Wasef , MFR SemiTech
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Sensor Technology Integration and Hermetic Module Fabrication Using Liquid Crystal Polymer
Abstract Presentation Susan Bagen (1), Eckardt Bihler (2), Marc Hauer (2), 1 - MST [Micro Systems Technologies], Mesa, AZ 85210; 2 - DYCONEX AG, Switzerland
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Hybrid Electronic Construction for Wireless ECG Monitoring Abstract Presentation Jonathan Knotts, Vito Licata - Creative Materials, Inc., Ayer, MA
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The Use of Advanced Microelectronic Packaging Techniques to Miniaturize Implantable Neuro Stimulators Abstract Presentation Carlos Segura (1) , Jake G. Hellman (1), John R. Burns IV (1), Alejandro J. Miranda (1), Elliot Greenwald (1), Andrew Czarnecki (1), Tirunelveli S. Sriram (1), Matthew Muresan (1), Brian Nugent (1), Dan Guyon (1), Wes Uy (1) , Edward Keefer (1), Johnathan Cheng (2), Steve Tillery (3), Caroline K. Bjune (1), John R. Lachapelle (1), and Jesse Wheeler (1); 1 - Draper, Cambridge, MA; 2 - Nerves Incorporated, Dallas, TX; 3 - Arizona State University, Tempe. AZ
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Thermal Resistance and Effective Thermal Conductivity Measurements of Thermal Grease Using the Flash Diffusivity Method Abstract Presentation Robert Campbell - Netzsch Corporation, Burlington, MA
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The Evolution of a Clinical Grade Wearable Vital Signs Monitor and the Role of Advanced Microelectronic Packaging Techniques to Increase Functionality Abstract Presentation James Ohneck - AEMtec/exceet North America, Cleveland / Akron, OH
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Session E: Interconnects Session Chairs: Mike McKeown , Hesse Mechatronics, Inc, Mineola, NY and William Boyce, SMART Microsystems, Elyria, Ohio
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Characterization of Epoxy Cure by Dielectric Analysis (DEA)
Abstract Presentation Yanxi Zhang, PhD - Netzsch Instruments North America, LLC, Burlington, MA 01803
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Nano Die attach Material used in High Power Electronic Device Package Abstract Presentation BeNazir Khan, UMass Lowell
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Wire Bonding Process: Understanding Ultrasonic Welding Abstract Presentation Lee Levine - Process Solutions Consulting, New Tripoli, PA
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Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design Abstract Presentation Paul Eichwald - Paderborn University, Paderborn, Germany
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Optimizing the Plasma Treatment Process Prior to Conformal Coating to Eliminate ESD Induced Failures Without Impact on Coating Performance Abstract Presentation Trevor Zitek, NanoBio Systems Inc., Lorain, OH
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Session F: Photonics & Optoelectronics Packaging Session Chairs: Yi Qian - MRSI Systems and Jin Li - Cambridge Technology
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Towards an Integrated On-chip Mid-infrared Chemical Sensing System Abstract Presentation Anuradha Agarwal - Massachusetts Institute of Technology, Cambridge, MA
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Integration of III-V Quantum Dot Lasers and Their Advanced Applications Abstract Presentation Wei Guo - University of Massachusetts Lowell, Lowell, MA
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Lasers in Advanced Packaging Abstract Presentation Xiangyang Song , Cristian Porneala, Dana Sercel, Kevin Silvia, Joshua Schoenly, Rouzbeh Sarrafi, Sean Dennigan, Eric DeGenova, Scott Tompkins, Vijay Kancharla, Marco Mendes - IPG Photonics, Marlborough, MA
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Prototype Photonic Integrated Circuits (ProtoPICs): A Flexible Platform for Hybrid Integration Abstract Presentation Dave Kharas - MIT Lincoln Laboratory, Lexington, MA
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The Challenges in High Volume Manufacturing of Photonic Devices Abstract Presentation Yi Qian - MRSI Systems, North Billerica, MA
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Session G: Poster Session Session Chairs: Dipak Sengupta - Consultant / Analog Devices Inc., Ret., Harvey Smith - EMA Sales & Marketing, Inc., and Dave Saums - DS&A LLC
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Micro-coaxial Cable Stripping with Electronic Flame-off Process Abstract Presentation Christian Wells (1,2) , Andrew Ye (1,3), Mitchell Meinhold (1), Heena Mutha (1), Caprice Gray (1), Jeffery DeLisio (1); 1 - Draper, Cambridge, MA; 2 - Northeastern University, Boston, MA; 3 - Carnegie Mellon University, Pittsburgh, PA
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Novel Photonic Vibration Sensor for In-situ Data Acquisition Abstract Presentation William Laratta, Micatu Inc., Horseheads, NY
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Dye-Pull Inexpensive Fast Failure Analysis Technique for Solder Joints Abstract Presentation Neeta Agarwal - Benchmark Electronics Inc., Nashua, NH
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Routing Algorithm for Complex Microelectronic Systems with Micro-Coaxial Interconnects Abstract Austin Herrling (1,2), Michael Ricard (1), Jason Haley (1), Juan Pablo Vielma (2), Anthony Kopa (1), David Hagerstrom (1), Caprice Gray (1); 1 - Draper, Cambridge, MA; 2 - Massachussetts Institute of Technology, Cambridge, MA
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Techniques to Reduce Solder Voiding Under BTC Components Abstract Michael Johnson - MACOM Technology Solutions, Lowell, MA
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Design of Experiment Analysis of the Lid of An Electronics Package Using Finite Element Analysis Abstract Nupur Bajad - Analog Devices Inc., Wilmington, MA
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On the Reliability of Highly Stretchable Electronic Interconnects Abstract Ashwin V. Zachariah , M.D. Nilsson, R.S. Sivasubramony, M.D. Poliks, P. Borgesen – Binghamton University, Binghamton, NY
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On the Behavior of Ink-Jet Printed Nano Silver Traces on Porous PET Substrates in Cyclic Loading Abstract Gurvinder Singh Khinda , Maan Kokash, Mohammed Alhendi, Jack Lombardi III – Binghamton University, Binghamton, NY
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Flexible Hybrid Electronic Circuits for Microwave Frequency Applications Abstract Presentation Jack P. Lombardi, Yilin Sung, Mohammed Alhendi - Binghamton University, Binghamton, NY
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Soldering of Commercial BGAs and CSPs to Low Cost Flexible Substrates for Wearable Medical Monitors Abstract Manu Yadav (1) , Thaer M. Alghoul (1), Mark D. Poliks (1), Peter Borgesen (1) - 1 Binghamton University, Binghamton, NY; Luke Wentlent (2), Michael Meilunas (2) - 2 Universal Instruments, Conklin, NY
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Fatigue of Aerosol Jet Printed Interconnections on Flexible Substrates Abstract Rajesh S. Sivasubramony , M. Alhendi, G.S. Khinda, M.Z. Kokash, J.P. Lombardi, A. Raj, D.L. Weerawarne, M. Yadav, A.V. Zachariah, M.D. Poliks, and P. Borgesen – Binghamton University, Binghamton, NY
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In Situ Functional Monitoring of Aerosol Jet-Printed Electronics Abstract Presentation Roozbeh (Ross) Salary (1) ,Jack P. Lombardi (1), Darshana L. Weerawarne (2), Prahalad K. Rao (3), and Mark D. Poliks (1,2); 1 - Department of Systems Science and Industrial Engineering,; (2) Center for Advanced Microelectronics Manufacturing, Binghamton University, Binghamton, NY; (3) Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE
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Reliability Analysis and Finite Element Modeling of a Flexible Hybrid Electronic Device Abstract Presentation Varun Soman (1) ,Mark D. Poliks (1), James Turner (1), Mark Schadt (2), Michael Shay (2), Frank Egitto (2); 1 - Binghamton University, Binghamton, NY; 2 - i3 Electronics Inc., Endicott, NY
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A Solder Joint Behavior Study of Extra Tall Packages by Digital Image Correlation (DIC) Method Abstract Van-Lai Pham ,Yuling Niu, Jing Wang, Huayan Wang, Shuai Shao, Charandeep Singh, Seungbae Park – Binghamton University, Binghamton, NY
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Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP Abstract Presentation Huayan Wang (1) ,Shuai Shao (1), Vanlai Pham (1), Panju Shang (2), Cheng Zhong (2), Seungbae Park (1) ; 1 - Department of Mechanical Engineering, Binghamton University, Binghamton, NY 13902 USA; 2 -Huawei Technology Co. Ltd, Shenzhen, Guangdong, China
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Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling Abstract Presentation Shuai Shao,Yuling Niu, Jing Wang, Ruiyang Liu, Seungbae Park - Department of Mechanical Engineering, Binghamton University, Binghamton, NY
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Photos of 2017 - 2018 Meetings - Photographer: Joseph W. Soucy
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Tuesday May 1st, 2018
Boxboro Regency Hotel, Boxborough MA
Call for Papers 2019
2018 Symposium Exhibitors
Earlybird Exhibitor Registration 2019
iMAPS New England Chapter
2017 - 2018 NE IMAPS Executive Committee
iMAPS - INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY
