242 Adams Place, Boxborough, MA
"Challenges and Opportunities in Shrinking RDL Features: Microstructure Control of Copper Deposits for Improved Fill and Reliability"
Speaker: Alejo Lifschitz Arribio, PhD, Senior Scientist, DuPont Electronic Materials R&D
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Summary: Advanced Materials are key enablers of new Advanced Packaging & Interconnect Technology Architectures, particularly in FO-WLP (Wafer-Level Fan-Out Packaging). Circuit miniaturization and densification hinges upon extending thermomechanical and feature fill capabilities of Copper Chemistries. We will highlight the renewed focus of plating chemistry suppliers on revamping their RDL products to increase fill uniformity over large ranges in feature shape and size. We will focus on limitations of traditional plating additive-based approaches and emerging feature fill approaches that extend via fill to aspect ratios below 0.1, then the mechanical challenges that arise from finer L/S dimensions and the opportunities to improve reliability performance. We will review the debate over re-engineering copper microstructure and provide new approaches to mechanical integration. Finally, we will demonstrate how adjacent challenges in seed etching and PR resolution limits can be addressed in the medium-term by exploiting highly tailored copper deposits that enable unparalleled control over line shape during plating. |
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SCHEDULE (times approximate): |
| 5:30 PM | Registration, Socializing, Networking & Cash Bar |
| 6:45 PM | Dinner - Boxboro Buffet - Stuffed Chicken Breast, Pasta Bolognese & sides | 7:30 PM | Presentation: “Challenges and Opportunities in Shrinking RDL Features: Microstructure Control of Copper Deposits for Improved Fill and Reliability” by Alejo Lifschitz, PhD Senior Scientist, Dow-DuPont Electronic Materials R&D division |
Registration
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You may attend the presentation without eating dinner. Pre-Registration deadline is Wednesday, February 19..!!! After that, or for Walk-Ins At-Door, the fee is an additional $5.00 [Limited Meal Availability]. Cancellations must be received by 3:00 p.m. Monday 02/24… or The Chapter will bill you for the registration fee. Options: To cancel a registration or register by e-mail, contact Matt Bracy: matt@msdsales.com |
Information & Registration