iMAPS New England Chapter
International Microelectronics Assembly and Packaging Society

Chapter Technical Meeting

Tuesday, April 12, 2016

Holiday Inn Boxborough

242 Adams Place, Boxborough, MA, 01719    
phone: 978-263-8701


"Taking Lead Out, Putting Plastic in BGA Solder Connections"
A Discussion of Polymer Core Solder Ball Technology Describing the technologies and comparing the performances of polymer core and solid solder balls.


Dr. Tom Marinis, Draper

Tom Marinis is a Distinguished Member of Technical Staff at Draper, working in the area of integrated electrical-mechanical systems. He was awarded a PhD in Material Science from Carnegie-Mellon University in 1981 and went to work at Bell Labs in Allentown, Pennsylvania, developing thin and thick film technologies for power and filter products. In 1987, Tom transferred to AT&T's Merrimack Valley facility and helped implement high volume flip chip assembly for switching products. Tom joined Draper Laboratory in 1995, working on packaging MEMs inertial sensors and fabrication of high density multichip modules. He is a Fellow of IMAPS and a past president of the IMAPS New England Chapter.

SCHEDULE (times approximate):

5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Dinner
7:30 PM Technical Presentation

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