iMAPS New England Chapter
International Microelectronics Assembly and Packaging Society

Chapter Technical Meeting & Annual Business Meeting

June 23, 2015

LOCATION: Devens Common Center, Devens, MA - (978) 772-0188

SCHEDULE (times approximate):

5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Dinner
7:15 PM Business Meeting & Election of Officers:
7:30 PM Guest Presentation

Nominees for Chapter Office for Fiscal Year 2015-2016
President - Dr. John Blum
Vice President - Mr. Jon Medernach
Treasurer - Mr. Minh Tran

Technical Presentation
"Package Warpage, Package-on-Package Warpage, and Package-on-Board Warpage: Update on Methods and Standards for the Determination of Warpage During Reflow"
Eric Moen, VP of Marketing & Sales – Akrometrix

Understanding warpage-at-temperature of packages as well as package attach locations on other packages and PCBs is critical in surface mount technology. This presentation presents a review of many past industry standards as well as a more detailed review of the IPC 9641 international standard. This presentation begins by summarizing the salient parts of past warpage standards and reports, including IPC-TM-650 2.4.22 (1999) JEITA-ED7306 (2007), 2008 - iNEMI PCB Coplanarity Work Group Industry Study: “PCB Dynamic Coplanarity at Elevated Temperatures” (2008), and sections of the IPC 9641 standard (2013) including, measurement equipment selection, test setup and methodology, and accuracy verification. The presentation goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are also highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.