Symposium Technical Chair
Roger S. Benson,
International Rectifier, Leominster, MA


2012 Technical Program At A Glance (last update 9-March-2012)




Session A: Surface Mount Technology - Session Chairs: Leo Lambert - EPTAC, and Tom Healy


"Void Free Soldering in Vapor Phase Reflow", John Bashe, Rehm Thermal Systems LLC

"Overcoming the Challenges of the QFN Package", Karl Seelig and Tim O'Neil, AIM Cranston, RI

"The Power & Performance of Smart Heat Technology: Performance Verification", Mike Connolly, REStronics NE

"Stencil Technology and the Role of Nanocoating", Rob Tyrell

"Evaluation of Stencil Materials, Manufacturing Processes and Coatings", Chrys Shea, Shea Engineering Services

"RoHS Recast", Kenneth Stanvick, DCA

Session B: Packaging A - Session Chairs: Jim McLenaghan - Creyr Innovation, and Bill Boyce - Sensata

"Critical Plating Configuration for Reliable Aluminum-to-Gold Wire Bonds", Richard Share, Share Consulting, LLC

"Satisfying Advanced Plating Requirements through Collaboration and Process Improvement", Manny Medeiros, Ametek Electronic Packaging

"Aluminum Inlay Lead-frame Design Considerations for Large Diameter Wire and Power-Clad Ribbon Bonding", Mike McKeown and Barry Njoes, Materion - Technical Materials

"A Comparison of Eutectic AuSn Alloy Delivery Options and Assembly Processes for LED Die-Attachment", Amanda Hartnett, Seth Homer, Indium Corporation, Utica, NY USA, Don Beck, and Daniel Evans, Jr., Palomar Technologies, Carlsbad, CA

"Flux Free Die Attach Utilizing Pressure Variation to Achieve Void Free Results", Bruce Wilson, SST International

"Moisture Sensing in Microelectronic Packages", Tom Green, TJ Green Associates LLC

Session C: Thermal/Power Management - Session Chair: David Saums - DS&A LLC , and Don Lockard

"Thermal Challenges for Wind Turbines", Peter Hansen, Vestas North America, and D. Saums, DS&A LLC

"Thermal Bottleneck LED Testing", Alexandra Francois-Saint-Cyr, and Jimmy He, Mentor Graphics Fremont CA USA

"Low Temperature Direct Aluminum Soldering Paste", William Avery, Superior Flux and Mfg. Co. Chicago IL USA

"TIM Reliability", Radesh Jewram, The Bergquist Company Chanhassen MN USA

"Metallic TIM Application for GaN RF", Amanda Hartnett, Indium Corporation, Dick Frey, Microsemi Bend, OR USA

Session D: TBD - Session Chair: John Roman - CTTEI

"High Power Semiconductor Fiber Laser Module Evolution", Ta-Jen Hou Worcester Polytechnic Institute IPG Photonics Corp.

"LCP & PTFE Substrate Technologies for RF Applications", Glen Thomas, Susan Bagen, Endicott Interconnect Technologies, Inc.

"Cost and Impact of Skills and Knowledge Base Training", Leo Lambert, EPTAC Corp

"Embedded and Integrated Passives", Tian Yang, Nanyang Technological University, Singapore

"No Clean Soldering and the Impact on DC Signals", Nathan Langford, Teradyne

Session E: Advanced Materials & Applications - Session Chairs: Dan Blazej - Assembly Answers , and Joe McCabe - Epoxy Technology

" Silver, Gold, Platinum, and Palladium Conductive Traces Printed using Nanoparticle Inks and Pastes", David Van Heerden, Hichang Yoon, and David Williams, NanoMas Technologies, Inc.

"Aerosol Jet Printing of A Silver-Epoxy Conductive Adhesive for High Density Applications", Kurt K Christenson and Michael J. Renn, Optomec; Donald J. Giroux, Resin Designs; Daniel C. Blazej, Assembly Answers

"New Developments in ENIG and ENEPIG for Today's Electronic Products", George Milad, UYEMURA Company

"Materials for Thin & Advanced Packaging Technology", Ken Araujo, NAMICS Technologies, Inc.

"Use of Encapsulants and adhesives for improved Reliability", Tina Barcley

Session F: Packaging B - Session Chairs: Jim McLenaghan - Creyr Innovation, and Bill Boyce - Sensata

"Understanding the Influences of the Drop-Shock Test Vehicle in Ultra-portable WLCSP", Matt Ring, Fairchild Semiconductor

"Damage Mechanisms & Acceleration Factors for No-Pb LGA, TSOP, & QFN Type Assemblies in Thermal Cycling", Liang Yin and Michael Meilunas, Universal Instruments Corporation; Luke Wentlent, Babak Arfaei, and Peter Borgesen, Binghamton University

"Reliable TMV PoP Assembly", Brian Roggeman and David Vicari, Universal Instruments Corporation; Lee Smith and Ahmer Syed, Amkor Technology, Inc.

"Pre-Stacking of Package on Packages Mitigating the Effects of Warpage", Farrell, Paul Bodmer, and Doug Sommer, Benchmark Electronics, Inc.

"Conformal Medical Electronics", Conor Rafferty, Dan Davis, Brian Elolampi, Colby Hobart, YY Hsu, Stephen Lee, and Henry Wei, MC10 Inc, Cambridge, MA

Session G: MEMS & Nano Packaging - Session Chairs: Dr. Jianyu Liang - Worcester Polytechnic Institute, and Sarah McLenaghan - Creyr Innovation

"Li2MSiO4/graphene Cathode Materials for Lithium Ion Batteries", Yinjie Cen, Cunguo Wang, Richard D. Sisson, Jr., Jianyu Liang, Worcester Polytechnic Institute

"Galvanic Synthesis of Novel Porous Metal Nanostructures and their Application as Electrochemical Biosensors", Molly Clay, Qingzhou Cui, Julie Chen, and Zhiyong Gu, University of Massachusetts Lowell

"Ferromagnetic Nanowires and Nanorings for Magnetic Random Access Memory (MRAM) and storage Devices", Nihar R. Pradhan, Xiaolin Hu, Stefan Dickert, Huajie Ke, Mark T. Tuominen, and Katherine E. Aidala

"Lead-free Nanosolders and their Application for Nanowire Assembly and Joining", Fan Gao, and Zhiyong Gu, University of Massachusetts Lowell

"Solution Processed Functional Oxide Nanostructures for Field Emission and Fire Safety Applications", Gregory Wrobel, Pu-Xian Gao, Univertisy of Connecticut

Session H: Solar/PV - Session Chair: Dr. Alan Rae - TPF Enterprises

"Searching for a Game Changer: Sorting New Materials Technologies for High Efficiency Solar Cells", Dr. Fatima Toor, Lux Research

"Photovoltaic Module Technology", Dr. Philip Heinz, Prismark Partners, LLC

"Use of Ink Jet Precision Deposition for Printed Microelectronics, Solar and Fuel Cell Manufacturing", Steve Liker, Trident Industrial Ink Jet

"String-Central-Inverter", Ingo Kraus, CEO, Wind & Sun USA, Inc.

"Novel Adhesion Methods for Solar Cell Assemblies using Pressure Sensitive Adhesives and Films", Jeff Caruso, Rob Thomaier, and Nathan Lipps, NuSil Technology

Session I: Posters - Session Chairs: Jun Wang - Saint-Gobain , and Michael Anello - MindSpring

"Synthesis and Characterization of Tin Oxide-Supported Platinum for Cathode Catalysts of Direct Methanol Fuel Cells", Manish Chawla, Tony Chou, Kevin McCarthy, Xi Geng, Ravindra Datta, and Jianyu Liang, Worcester Polytechnic Institute

"Adhesion Strength Ag Nanoparticles", Robert Cakoune, Michael Judelso, Nancy Burnham and Jianyu Liang,Worcester Polytechnic Institute

"Developing Lead-free Nanosolders for Nanoelectronics Assembly and Packaging", Fan Gao, and Zhiyong Gu, University of Massachusetts Lowell

"Novel Porous Metal Nanostructures for Electrochemical Biosensor Applications", Molly Clay, Qingzhou Cui, Julie Chen, and Zhiyong Gu, University of Massachusetts Lowell

"Low Melting Point Tin/Indium (Sn/In) Nanosolder Particles: Synthesis and Applications", Yang Shu, Karunaharan Rajathurai, Fan Gao, Qingzhou Cui, and Zhiyong Gu, University of Massachusetts Lowell

"Individual domain wall manipulation along ferromagnetic nanowires in a local oersted circular field for memory storage devices", Nihar R. Pradhan, Xiaolin Hu, Huajie Ke, Stefan Dickert, Mark T. Tuominen, and Katherine E. Aidala, Mount Holyoke College/UMass Amherst

"ACES characterization of damping in micro-beam resonators", Xiuping Chen, Vu D. Nguyen, Jason C. Parker, and Dr. Ryszard J. Pryputniewicz, Worcester Polytechnic Institute

Copyright 2011 iMAPS New England Chapter
iMAPS New England Chapter
International Microelectronics And Packaging Society